Micron Laser Technology provides PCB Depanelizer and part excising solutions for consumer products, original equipment manufacturers, and printed circuit board manufacturers. MLT’s numerous laser machining centers are geared up to deal with volumes from prototyping to long production runs. Laser depaneling or part excising can cut through metals, plastics, dielectrics, or a mix of both.
Depending on the material as well as the part requirements, MLT offers a tool-less part removal process as final depaneling, hold-in tabs, scoring (v-grooves), and perforations. These laser processes have the main benefit of speed, positional accuracy, no tooling cost or wear, no part induced stresses, and no cutting oils or any other contaminants.
Hold-in tabs are small uncut sections about the part used to secure the part within the panel. The hold-in tabs can be used for easy of handling small parts or part securement for additional processing. The hold-in tab width is chosen based on the quantity of force desired to removed the part through the panel/sheet or known forces to be applied by downstream processes like component loading or electro-polish. MLT can make tabs generally in most any material and also to any width and location about the part.
Laser scoring produces a limited depth ablation line within the part or material set. The depth is usually 50% in the material thickness but may be controlled to a desired depth. The scoring acts just like the hold-tab to secure the part inside the panel or sheet, but enables individual parts to become ‘snapped’ out. Laser scoring lines can also be used as a deliberate path for stress relief or crack propagation. Prototypes utilize scoring lines in metal to accurately bend and form parts into condition without expensive forming dies.
Comparable to scoring or v-grooves, laser perforations are another choice for tool-less part removal from the panel or sheet. Perforations can be laser formed for any size and spacing to fulfill the required removal and Manual PCB Depanelizer. Depending on the material and the part requirements, BEST laser services provides a tool-less part removal process by means of final perforation, scoring and hold-in tabs. Utilizing a laser to do the depaneling affords the user the main benefit of speed and positional accuracy. Unlike mechanical methods there is not any part induced stresses, no tooling cost and no cutting oils or other contaminants.
Laser depaneling is ideal for rigid-flex boards as it provides a precise method to cut through a variety of materials including although not restricted to the following most typical materials seen:
Combinations thereof, suitable for thicknesses of rigid flex laser depanelization, rigid flex depanelizedIn addition BEST may be that provider of laser depanelization when you have lots of IoT devices which lmuteg to be precisely machined or reduce to suit perfectly directly into small mechanical enclosures.
Due to the contact-free processing that continues with laser depanelization of printed circuit boards, there is little distortion even when thin materials are used. When boards are milled or punched out utilizing a mechanical tool there might turn out to be a loss precision and potentially a distortion in the outside board dimensions. Even worse it might crack solder joints when using these mechanical means. In BEST laser depanelization system feature fiducial registration and web-based scaling, meaning already existing distortions can be compensated as well as the cut contours positioned precisely inside the layout.
The ways for straight line PCB Laser Depaneling, which can be setup for rectangular-shaped PCBs, all cut or crush the edge of the board edge. These methods include die cutting, punching or V-scoring the assembly or simply by using a wheel cutter or even a saw. The sawing method typically uses a single rotating blade spinning at high RPM to slice the panel to the shapes required. This method produces heat within the reduce area as
well as creating debris being a byproduct of the cutting operation. In V-scoring the depth of the thickness in the board is 30-40% of the original board thickness since it is cut from each side of the board. After assembly the board is broken around this v-score line. Alternately a “pizza cutter” cuts from the V-score from the panel and cuts the remaining web up until the boards have been in their final cutout shape thereby putting strain on the components and solder joints-especially those near the board edge. In another method, the singulated board outline could be punched out constitute the panel. This calls for which a new punch be used for every form of circuit board meaning it is really not a flexible way of board eliminate. The punch force can also bend or deform the sides from the PCB.